Microwave Engineering
Theory
Teaching Scheme Examination Scheme
Lectures: 3 Hours/Week Theory: (CIE+SEE) = (50+50) =100 Marks
Credits: 03 Minimum passing: (20+20) = 40 Marks
Laboratory
Teaching Scheme Examination Scheme
Practical: 2 Hours/Week IPE: 50 Marks
Credits: 01 Minimum passing:20
Course Outcomes :
CO1
: Discuss basic microwave system, its applications and hazards caused.
CO2 : Evaluate transmission line parameters and differentiate between
different types of transmission lines.
CO3 : Design different microwave components using waveguides.
CO4 : Illustrate generation and amplification of microwaves using
microwave tubes and semiconductor devices.
CO5 : Differentiate between Hybrid and Monolithic Microwave Integrated
Circuits.
CO6 : Interpret and apply techniques
for microwave measurements.
UNIT I. Introduction (4 Hrs)
Microwave bands, microwave characteristics, microwave system, traditional, industrial and biomedical applications, microwave hazards.
UNIT II. Transmission line (7 Hrs)
Circuit representation of transmission line, transmission line equations, sinusoidal excitation of transmission line, impedance and its Transformation, Smith Chart and its applications, impedance matching techniques. Co-axial line, rectangular and circular wave guides, introduction to strip lines, microstrip lines and co-planar wave-guides.
UNIT III. Wave guide components (5 Hrs)
Transmission line resonators, Rectangular and circular cavity resonators, introduction of sparameters, Hybrid junctions, Directional couplers, circulators, isolators, wave, guide terminations, Attenuators, Phase-shifter
UNIT IV. Microwave tubes and semiconductor devices (7 Hrs)
Reflex klystrons, Multi cavity klystron, Helix TWT, Coupled cavity TWT, Backward wave oscillator, magnetron, Forward wave cross field Amplifiers. Point contact diodes, Schottky barrier diodes, PIN diodes, varactor diodes, tunnel diodes, Gunn devices, IMPATT diode, parametric devices, Detectors and Mixers.
UNIT V. Hybrid and Monolithic MICs (8 Hrs)
Definition hybrid MIC, characteristics, comparison with conventional circuits, fields of application and limitations and criteria for the choice of substrate material; thin film hybrid circuits, thick film hybrid circuits, artwork, mask making, photolithography, resistor stabilization, sawing, brazing process, wire bonding. Definition monolithic MIC, substrate structure, doping by ion implantation ohmic contact, metal resistive layers, gate metal, dielectric second level metal, dielectric and air bridge vias, substrate vias, final wafer process steps.
UNIT VI. Microwave measurements (3 Hrs)
VSWR, Frequency, Power, Noise, Q Factor, Impedance, Attenuation, Dielectric Constant,
antenna Gain.
Text Books:
1. Microwave Devices and circuits - Samuel Liao PHI Publication
2. Microwave Engineering - David Pozar ,John Wiley and Sons publication
- Teacher: Kishor Dalavi DoT